Component Bulletins

EIA CB 1
Revision / Edition:     Chg:    Date: 1956
Printed Wiring Terms and Definitions

EIA CB 2
Revision / Edition:     Chg:    Date: 1959
Contamination of Printed Wiring Boards

EIA CB 3
Revision / Edition: B    Chg:    Date: 1966
Specifications and Standards Associated with Solders and Soldering

EIA CB 4
Revision / Edition:     Chg:    Date: 1965
Effect of the Wire Diameter on Wirewound Resistors Reliability

EIA CB 5
Revision / Edition:     Chg:    Date: 1969
Recommended Test Procedure for Semiconductor Thermal Dissipating Devices

EIA CB 5-1
Revision / Edition:     Chg:    Date: 1971
Recommended Test Procedure for Semiconductor Thermal Dissipating Devices

EIA CB 6
Revision / Edition: A Chg:    Date: 1987
Guide for the Use of Quartz Crystal Units for Frequency Control

EIA CB 7
Revision / Edition:  Chg:    Date: 1980
Occular Safety Aspects of LED’s in Fiber Optic Systems

EIA CB 8
Revision / Edition:     Chg:    Date: 1981
List of Approval Agencies, U.S. and Other Countries Impacting Electronic Components and Equipment

EIA CB 9
Revision / Edition: F    Chg:    Date: 1987
Reference Guide for Fiber Optic Test Procedures

EIA CB 10
Revision / Edition:     Chg:    Date: 1983
Supplementary Military Requirements for FOTP-12 Fluid Immersion Test Procedure for Fiber Optic Connecting Devices

EIA CB 11
Revision / Edition:       Chg:      Date: 1986
Guidelines for the Surface Mounting of Multilayer Ceramic Chip Capacitors

EIA CB 12
Revision / Edition:       Chg:      Date: 1990
Gold Plating Study Test Report

EIA CB 13
Revision / Edition:       Chg:      Date: 1990
X-Ray Fluorescence for Measuring Plating Thickness

EIA CB 14
Revision / Edition:       Chg:      Date: 1993
Contact Lubrication

EIA CB 16
Revision / Edition:       Chg:      Date: 1999
Integrated Passive Device (IPD) Definitions

EIA CB 18
Revision / Edition:       Chg:      Date: 2002
Solid Tantalum Capacitor Shelf-Life

EIA CB 19
Revision / Edition: A      Chg:      Date: 2005
The Facts About Tin Whiskers

EIA CB 20
Revision / Edition:      Chg:      Date: 2005
Correct Orientation of Tantalum and MLC Capacitors in EIA-481

EIA CB 21
Revision / Edition:      Chg:      Date: 2005
Counterfeit Passive Components

EIA CB 22
Revision / Edition:      Chg:      Date: 2005
Comments on Test Methods & Criteria for Tin Whiskers in Surface Mount Passive Devices

EIA/ECA-CB23
Revision / Edition:      Chg:      Date: 2007
Environmental Acceptance Requirements for Whisker Susceptibility of Pb-Free Alloy Surface Finishes

EIA/CB-24
Revision / Edition:      Chg:      Date: 2008
China RoHS Environmental Friendly Use Period (EFUP) Marking Requirements

EIA/CB-30
Revision / Edition:      Chg:      Date: 2015
Industry Response to Potential Elimination of RoHS Exemption 7(c)-I